Yield Engineering Systems (YES) is a top manufacturer of process equipment for AI and HPC semiconductor solutions. YES recently announced that it has received multiple orders for its VertaCure PLP systems for advanced packaging from a leading semiconductor manufacturer in Japan. These systems are set to be used in the manufacturing of AI and HPC solutions, supporting 2.5D/3D packaging. YES products have a strong reputation for providing superior quality curing, coating, and annealing for both R&D environments and high volume manufacturing processes.
VertaCure PLP is an automated vacuum curing system that ensures complete removal of residual solvents, uniform temperature distribution, and precise management of heating and cooling rates. The system offers benefits such as no outgassing after cure and excellent particle performance. It can accommodate various panel sizes, including 600 mm x 600 mm, 510 mm x 515 mm, and 300 mm x 300 mm.
Saket Chadda, SVP of Dry BU at YES, emphasized the importance of accommodating larger substrate sizes and increasing bandwidth requirements in the semiconductor industry. He highlighted how VertaCure PLP is a production-proven automated vacuum cure system that delivers superior film performance and higher throughput than atmospheric curing. The system’s multi-zone temperature control system with laminar flow ensures excellent uniformity and particle performance required for various applications in the semiconductor industry.
Alex Chow, SVP Worldwide Sales and Business Development at YES, expressed excitement over the significant purchase order, solidifying the company’s position as a market leader for curing tools. The VertaCure PLP product line is known for providing a controlled, reproducible, and scalable manufacturing process for bonding and polymer cure applications. This system offers superior quality and total cost of ownership for customers, particularly for the manufacturing of advanced 2.5D and 3D packaging solutions in the semiconductor industry.
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