Siemens Digital Industries Software application today revealed that South Korea-based nepes corporation, a worldwide leader in Outsourced Semiconductor Setting Up and Examination (OSAT) solutions, has actually leveraged a variety of advanced design streams from Siemens EDA to take on the wide variety of intricate thermal, mechanical, and various other IC packaging design obstacles connected with establishing advanced 3D-IC plans
“nepes is committed to providing us with the most comprehensive portfolio of semiconductor packaging design and manufacturing services, to help us innovate and succeed in a market where high performance and compact form factors are critical.” claimed Brad Search engine optimization, vice head of state of SAPEON Korea’s R&D facility. “By expanding nepes’ adoption and usage of Siemens’ EDA technologies for advanced packaging, we also can achieve the innovative technologies necessary to grow.”
nepes has a well established performance history of offering consumers with first-rate packaging, screening, and semiconductor setting up solutions for customers throughout the worldwide electronic devices sector. nepes additionally provides packaging design solutions consisting of wafer-level packaging, fan-out wafer-level plans, and panel-level packaging.
Structure on this structure, nepes is currently driving extra packaging technology with a wide variety of advanced modern technologies from Siemens EDA, consisting of the Quality ® nmPlatform, that includes Quality ® 3DSTACK software program, HyperLynx ™ software program for electric policy monitoring, in addition to Siemens’ industry-leading Xpedition ™ Substratum Integrator software program and Xpedition ™ Plan Developer software program. With each other, these Siemens modern technologies assisted nepes give quick and trusted design solutions consisting of 2.5 D/3D- based chiplet styles for the firm’s expanding base of worldwide IC consumers.
“Siemens is committed to delivering industry-leading semiconductor packaging technologies to supply chain partners such as nepes, which helps enable them to achieve their digitalization goals,” claimed AJ Incorvaia, elderly vice head of state of Electronic Board Equipments at Siemens Digital Industries Software Program. “As an existing partner and supplier to nepes we are pleased to extend this relationship for the advantage of our mutual customers.”
Discover More concerning exactly how Siemens is aiding the worldwide incorporated circuit sector.
