Introducing the MRSI-LEAP High-Speed 1µm Die Bonder by MRSI Mycronic
MRSI Mycronic is thrilled to announce the launch of the MRSI-LEAP high-speed 1µm die bonder, designed for ultra-high-volume manufacturing of optical modules like Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Board (CoB) assemblies using epoxy processes.
The MRSI-LEAP high-speed 1µm die bonder comes equipped with a range of innovative features that make it a must-have tool for ultra-high-volume manufacturing. It offers unmatched efficiency with outstanding precision (<±1µm @ 3σ) ensuring long-term stability and high precision in continuous die bonding applications to support ultra-high volume driven by AI.
This cutting-edge machine supports various input forms, including wafer, waffle pack, and Gel-Pak®, along with customized fixtures. It also features an automatic tool changing function to accommodate different die sizes. Additionally, it boasts a high throughput capacity with a conveyor system designed for single fixture or multiple cassette inputs, allowing for the automatic transport of large carriers of dies for AOC, CoB, gold-box packaging, and CoC assemblies in fixtures.
The MRSI-LEAP also offers advanced process options such as flip-chip bonding, UV epoxy dispensing, in-situ UV curing, and wafer-level packaging, making it a versatile and powerful solution for diverse manufacturing requirements.
“To address the growing demand for high-speed optical modules in AI-driven manufacturing, we are excited to unveil the MRSI-LEAP high-speed 1µm die bonder machine,” stated Dr. Yi Qian, Mycronic Group VP & MRSI Systems General Manager. “This new product significantly enhances production efficiency while maintaining ultra-high precision, ultimately increasing the return on investment for our customers. MRSI is dedicated to continuous innovation to deliver value to our customers.”
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