Infineon expands its Bluetooth portfolio with eight new parts, including the AIROC CYW89829 Bluetooth LE MCU for automotive applications

Infineon Applied sciences AG introduced the growth of its Bluetooth portfolio by eight new merchandise in the AIROC CYW20829 Bluetooth Low Vitality 5.4 microcontroller (MCU) household, that includes Techniques-on-Chip (SoCs) and modules optimized for industrial, shopper, and automotive use instances. The excessive integration of the CYW20829 product household permits designers to scale back bill-of-material (BOM) value and gadget footprint in all kinds of applications, including PC equipment, low-energy audio, wearables, photo voltaic micro inverters, asset trackers, well being and way of life, residence automation and others. Product designers additionally profit from Infineon’s wealthy growth infrastructure and dedication to strong safety, with help for safe boot and execution environments and cryptography acceleration to safeguard delicate knowledge.

The newest automotive half in the product household, the AIROC CYW89829 Bluetooth Low-Vitality MCU, is right for automotive entry and wi-fi battery administration methods (wBMS) applications, as a consequence of its strong RF efficiency, lengthy vary and newest Bluetooth 5.4 options including PAwR (Periodic Promoting with Responses). The twin ARM Cortex core design of the chip household options separate software and Bluetooth Low Vitality subsystems that ship full featured help for Bluetooth5.4, low-power, 10 dBm output energy with out a PA, built-in flash, CAN FD, crypto accelerators, excessive safety including Root of Belief (RoT), and is PSA stage 1 prepared. “Infineon offers one of the industry’s broadest portfolios of IoT solutions. Our Bluetooth solutions offer robust connectivity and the latest features,” stated Shantanu Bhalerao, Vice President of the Bluetooth Product Line, Infineon Applied sciences. “Our automotive AIROC CYW89829 Bluetooth LE MCU, and versatile AIROC Bluetooth CYW20829 LE MCU deliver ultra-low power and a high degree of integration for a better user experience across various applications in automotive, industrial, and consumer markets.”

Infineon has been working with prospects to design with present merchandise in the CYW20829 household and has acquired constructive opinions:

“The Infineon CYW20829 is the leading Bluetooth part in the market, which has passed the latest Bluetooth 5.4 certification,” stated Kevin Wang, CEO of ITON. “CYW20829 has very good RF performance, supports PAwR and LE Audio. These features bring more possibilities in consumer and industrial markets.”

“CYW20829, with perfect RF performance, flexible API, and good long-range features, provides a good solution for commercial lighting, industrial IoT, and more,” stated Cai Yi, CEO of Pairlink.

“Earlier this year, the Bluetooth SIG released version 5.4 of the specification with new features: Periodic Advertising with Responses and Encrypted Advertising Data. These features implemented on Infineon’s CYW20829 chips allow Addverb to develop a secure monitoring and controlling system for a fleet of wireless robots in the industrial warehouse, satisfying safety requirements,” stated Tapan Pattnayak, Chief Scientist at Addverb, a worldwide chief in robotics.

Availability

The new merchandise can be found in a spread of variants, every with its particular characteristicsand focus applications.

Merchandise at present in manufacturing are:

CYW20829B0000, in a 56QFN SoC package deal, 6×6 mm, designed for PC equipment, remotes, ESL, and low-end BLE MCUs

CYW20829B0010, packaged in 56QFN SoC with a dimension of 6×6 mm, appropriate for gaming equipment and LE Audio merchandise

CYW20829B0-P4EPI100 and CYW20829B0-P4TAI100 modules, each with a dimension of 14.5×19 mm, appropriate for long-range, asset monitoring, energy instruments, and generic Bluetooth LE use instances

Sampling now are:

CYW20829B0021, in a 40QFN SoC package deal, 6×6 mm, suited for industrial and long-range applications

CYW89829B0022, in a 40QFN SoC package deal 6×6 mm, designed for wi-fi BMS and automotive entry

CYW89829B0232, in a 77BGA SoC package deal, 7×8 mm, appropriate for wi-fi BMS and automotive entry

In the second quarter of 2025, samples are anticipated of the CYW20829B1230, which might be obtainable in a 64 Ball BGA SoC package deal with a dimension of 4.5×4.5 mm and appropriate for wearables, energy instruments, and asset monitoring

Extra info associated to the AIROC CYW20829 Bluetooth LE MCU household will be discovered right here

Extra info associated to the AIROC CYW89829 Bluetooth LE MCU will be discovered right here.