Indium Corporation was honored with a Global Technology Award throughout an award ceremony on October 22, 2024, at SMTA International in Rosemont, Illinois. The corporate acquired the popularity within the solder paste class for Indium8.9HFRV, a low-voiding, air reflow, no-clean solder paste that gives glorious stencil print switch effectivity, response-to-pause efficiency, wetting, and coalescence.
Introduced by Global SMT & Packaging, the Global Technology Awards acknowledge the very best new improvements within the printed circuit board meeting and packaging industries launched within the earlier 12 months.
“We are honored to accept this prestigious Global Technology Award for innovation, and extremely proud of our dedicated colleagues who developed Indium8.9HFRV as a unique solution to customer needs,” stated Product Improvement Specialist Kevin Brennan. “Indium8.9HFRV is the superior option for high-reliability alloy systems, providing excellent voiding performance, thermal cycling reliability, as well as electrochemical reliability.”
Indium8.9HFRV is a flux car and drop-in resolution absolutely appropriate with the usual SnAgCu, SnAgCuSb high-reliability alloy programs favored by the electronics trade, and Indium Corporation’s enhanced thermal biking, low-voiding alloy, Durafuse® HR. It’s also appropriate with each air and nitrogen reflow environments. It’s designed for no-clean functions; nonetheless, the flux will be eliminated, if vital, through the use of a commercially obtainable flux residue remover. It additionally options excessive switch effectivity via small apertures and will be coupled with Kind 4 and Kind 5 powder sizes.
