IMAPS 20th Yearly Gadget Product Packaging Meeting– Occasion Emphasizes
The International Microelectronics Setting Up and Product Packaging Culture (IMAPS) 20th yearly Gadget Product Packaging Meeting (DPC), is set up from March 18 to 21 in Water Fountain Hills, AZ. Concurrently, the Workshop on Advanced Product Packaging for Clinical Microelectronics will certainly happen at the WeKoPa Hotel and Meeting Facility. This meeting works as a vibrant system for researchers, designers, teachers, trainees, and market specialists to talk pertaining to advancement within gadget product packaging.
3D Prompts Occasions at IMAPS DPC 2024
As the Authorities Sector Companion, 3D InCites has numerous vital occasions taking place throughoutIMAPS DPC 2024 Initially, is the 2024 3D Prompts Honors Event, which occurs on Tuesday early morning, after the keynote talks at 9:55. Discover this year’s 3D Prompts Honors Champions. On Wednesday night, 3D Prompts member business and their visitors are welcomed to a 3D Prompts Member Social: The Backyard Olympics.
Last But Not Least, for the 3rd successive year, KLA is the title enroller of the Walking for DEI, which occurs on Thursday mid-day, leaving WeKoPa at 12:30. Information are right here.
IMAPS DPC 2024 Program Featuring 3D Prompts Participants
IMAPS DPC 2024 assures an improving experience with 5 keynote talks, a half-day of expert growth programs, and 3 meeting tracks chaired by numerous 3D Prompts Participants:
The program will certainly cover a variety of subjects throughout 3 tracks, consisting of:
Heterogeneous assimilation
Fan-0ut, wafer degree product packaging (WLP), and turn chip
Next-gen applications like automobile and 5G/6G.
On Monday, March 18, Mark Gerber (ASE) will certainly be carrying out a course on System-in-Package (SiP) System Solutions Via Miniaturization from 8 a.m. to 10 p.m. and The Advancement of Flip Chip Bundle Modern technology from 1 p.m. to 3 p.m.
On Tuesday, March 19 from 9:10 -9:55, Arvind Kumar, IBM will certainly provide the opening keynote, Fulfilling the Eruptive Needs of AI with Chiplet Styles
Technical Tracks
Heterogeneous 2D & & 3D Combination Track: Refine Advancement
Divya Taneja, IBMReliable Direct Bonded Heterogeneous Combination (DBHI) for AI HardwareTuesday, March 19, 2024, 10:45- 11:15 am
Manjusha Mehendale, Onto InnovationApplication of Picosecond Acoustic Width for Keeping An Eye On Steel Movies in Advanced PackagingTuesday, March 19, 2024, 11:15 -11:45 am
Lars Böttcher, Fraunhofer IZMHigh-Density Organic Substrates for Chiplet TechnologiesTuesday, March 19, 2024, 11:45 -12:15 am
Fan-Out, Wafer Degree Product Packaging & & Flip Chip Track: Layout & & Application
John Park, CadenceA Unique Method to Co-Design of Analog and RF Multi-Die PackagesTuesday, March 19, 2024, 9:55 -10:14 am
Gaurang Gunde, DECADelivering the Complete Advantages of Maskless Lithography and Adaptive Pattern with Comprehensive Layout AutomationTuesday, March 19, 2024, 11:15 -11:45 am
Fan-Out, Wafer Degree Product Packaging & & Flip Chip Track: Fan-Out Innovation
John Chang, Onto InnovationFOPLP Lithography Pass Away Change Mistake Obstacles And Remedy Making Use Of Feedforward Adaptive Shot TechnologyTuesday, March 19, 2024, 4:30 -5:00 pm
Johannes Ruoff, ZeissRapid 3D X-ray Wafer-level Assessment of Interconnects in Advanced PackagingTuesday, March 19, 2024, 5:00 -5:30 pm
Jan Vardaman, TechSearch International, Arvind Kumar, IBMMike Kelly, AmkorEvening Panel Conversation: Seeking the Following Awesome Application: Will Certainly Heterogeneous Combination be the Enabler?Tuesday, March 19, 2024, 7:00 -8.00 pm
Heterogeneous 2D & & 3D Combination Track: Layout and Innovation
Clifford Sandstrom, DECAAchieving Large-Scale HBM Combination with Flexible Pad Piles on Molded Installed Bridge Pass Away InterposersWednesday, March 20, 2024 2:00 -2:30 pm
Shelby Nelson, Mosaic MicrosystemsThin Glass Interposers with High-Density InterconnectsWednesday, March 20, 2024 2:30 -3:00 pm
Lihong Cao, ASEAdvanced Mechanical Evaluation Operations for Chiplets Combination Anticipating DesignWednesday, March 20, 2024 3:00 -3:30 pm
Eelco Bergman, Saras Micro DevicesSaras Installed STile IPD Innovation for High-Performance Power Distribution NetworksWednesday, March 20, 2024, 4:30 -5:00 pm
Heterogeneous 2D & & 3D Combination Track: Item Application
Mike Kelly, Amkor TechnologyChiplets and Heterogeneous IC Product Packaging: Structure Blocks and TradeoffsThursday, March 21, 2024, 10-10:30 am
Lee Sheng, ASEHeterogeneous Combination Framework with Fanout and Substratum for Premium ProductThursday, March 21, 2024, 11:30 am-12:00 pm
Fan-Out, Wafer Degree Product Packaging & & Flip Chip Track: Flip Chip Innovation
Britta Schafsteller, MKS-AtotechSoldering Issues on Immersion Tin and the Effect of the Tin-oxide LayerThursday, March 21, 2024, 11:00 am-11:30 pm
Next-Gen Applications Track: Product Packaging for Advancing Markets and Demands
Sheng Lee, ASEEmbedded Multi-die Innovation for SESUB ApplicationThursday, March 21, 2024 10:00 am-10:30 pm
Poster Session
Nils Anspach, LPKF TechnologiesEnhancing Microelectronic Efficiency: Examination on Surface Area Morphology and Roughness of Laser-Induced Deep Etching (LIDE) Micro-structured Glass
YoungDo Kweon, Amkor TechnologyHigh Thermal Efficiency Thermal User Interface Product (TIM) for Advanced Semiconductor Products
Roland Rettenmeir, EvatecBack Side Metalization for High-Performance Computer
Oliver Zhao, AdeiaSurface Width and Issue Characterization for Crossbreed Bonding
KyungSu Kim, Amkor TechnologyLow-cost Remedy for Thermally Boosted, Heat-Spreader ChipArray ® BGA (CABGA) Plans
Mike Flatley, Amkor Innovation, Inc.Pursuing Ideal Price of Possession in Leadless Leadframe Product Packaging
Vineet Pancholi, Amkor Innovation, Inc.Amkor In-house Examination Solutions
Meet 3D Prompts Exhibitors in the Display Hall
Participants can likewise go through the Display Hall at the 2023 Gadget Product packaging Meeting and pay attention to exhibitors speak about their experiences. 3D prompts member displays consist of:
