Wolfspeed & Hemlock Semiconductor Get Their CHIPS Act Share
Arizona Facility to Deal with Excessive Efficiency Computing
In IFTLE 577 we reported that Amkor had introduced plans to construct a complicated packaging and take a look at facility in Peoria, Arizona.
In IFTLE 603 we reported that Amkor Know-how had signed a preliminary memorandum of phrases with US Division of Commerce for an Amkor Arizona Superior Packaging and Check Facility to obtain as much as $400MM in direct funding and $200MM in loans from the CHIPS Act to assist the corporate’s reported $2B funding within the proposed OSAT plant. The ability could be the biggest OSAT facility within the US.
In IFTLE 609, IFTLE reported that TSMC and Amkor had signed a memorandum of understanding (MoU) the place Amkor will present TSMC with superior packaging and take a look at companies from its deliberate meeting and take a look at firm plant in Peoria, Arizona.
The 2 corporations stated, “the close collaboration and proximity of TSMC’s front-end fab and Amkor’s back-end facility will accelerate overall product cycle times,” including that they are going to “jointly define the specific packaging technologies” used to handle widespread buyer wants, reminiscent of TSMC’s Built-in Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS) that will probably be employed to handle widespread clients’ wants.
IFTLE has just lately had discussions with Dave McCann, Sr. VP at Amkor Know-how in Arizona to see if we might additional outline the corporate’s deliberate exercise.
McCann has shared that Amkor plans to put in a high-volume superior packaging manufacturing facility together with:
Full turnkey 300mm bump/probe/meeting/testAdvanced IC on substrate packagingAdvanced wafer-based packagingAn ITAR compliant facility
Amkor’s focus will probably be superior packaging for synthetic intelligence (AI), excessive efficiency computing (HPC), automotive and cellular. Plans are to have the ability on line by early 2028.
The bumping line would enable Amkor to bump superior chips produced on shore for corporations like TSMC, GF and others constructing excessive efficiency chips within the US underneath the CHIPS Act.
IFTLE sees this as a serious “on shoring” announcement.
Wolfspeed
The U.S. Division of Commerce and Wolfspeed have signed a preliminary memorandum of phrases (PMT) to supply as much as $750 million in direct funding underneath the CHIPS and Science Act, to assist the development of a brand new 200mm silicon carbide (SiC) wafer manufacturing facility in Siler Metropolis, NC.
Along with Wolfspeed’s North Carolina SiC undertaking, the proposed CHIPS funding is anticipated to catalyze its deliberate enlargement of its machine manufacturing facility in Marcy, NY. The tasks are a part of the corporate’s introduced $6B capability enlargement plan.
Based in 1987 as a spin out of NC State school and college students, Wolfspeed, (previously often called Cree) is the world’s main producer of wafers and units produced from SiC. SiC units energy electrical automobiles (EVs) and plug-in hybrids, enabling prolonged driving range-per-charge, sooner charging occasions, and decrease total techniques prices. Past EVs, Wolfspeed’s units are utilized for renewable vitality techniques, industrial capacities, AI and purposes for the USA army.
The 2MM ft. sq. NC facility would be the US’s largest SiC wafer manufacturing facility and the world’s first high-volume 200mm silicon carbide wafer manufacturing facility. The Marcy, NY facility, would be the world’s first absolutely automated 200mm silicon carbide energy machine fab and enhance its manufacturing capability by roughly 30%. This fab is certified to serve each automotive and industrial and vitality clients.
Due partially to those proposed tasks, Wolfspeed anticipates reaching a five-fold enhance in its silicon carbide machine output and a ten-fold enhance in 200mm supplies manufacturing capability.
The proposed CHIPS funding can be anticipated to catalyze personal capital funding of one other $750 million to assist the corporate’s enlargement plans.
Hemlock Semiconductor will get $325M funding from CHIPS Act
The Division of Commerce and Hemlock Semiconductor signed a non-binding preliminary memorandum of phrases to supply as much as $325 million in proposed direct funding underneath the CHIPS and Science Act.
The brand new facility will probably be situated at HSC’s campus in Michigan and will probably be devoted to the manufacturing and purification of hyper-pure semiconductor-grade polysilicon.
Based in 1961, HSC is the one U.S.-based producer of hyper-pure polysilicon and is one in every of simply 5 corporations on the planet producing polysilicon to the purity stage wanted to serve the semiconductor market.
Building of the brand new facility is anticipated to start in 2026. Manufacturing ought to start in 2028 with full manufacturing capability by the top of 2028 or in early 2029.
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