The European semiconductor packaging group, along with its worldwide colleagues, provide chain companions, prospects and visitors met for a full week totally devoted to Semiconductor Packaging, Meeting and Take a look at from September 9-13, 2024, at Mercure Lodge MOA Berlin and with it depicted the biggest Packaging occasion in Europe in 2024. 3D InCites was Media Accomplice of each occasions.
Complementing one another, the third SEMI EuroPAT-Workshop (September 9-10, with 75 attendees) targeted on manufacturing and provide chain, whereas the tenth IEEE Electronics System-Integration Expertise Convention (ESTC) (September 11-13, with 430 attendees) targeted on new developments, roadmaps and rising applied sciences emblazed from each the educational and industrial aspect. This excellent mixture underlines tge required shut collaboration wanted in occasions of the EU Chips Act.
The EuroPAT-Workshop is organized by ESiPAT-TC, the European Chapter of the SEMI-built-in Packaging, Meeting and Take a look at – Expertise Neighborhood (SiPAT-TC), a particular curiosity group beneath the umbrella of SEMI. It at all times takes place at or near an organization that gives electronics packaging manufacturing providers in Europe. This 12 months, Swissbit Germany AG in Berlin- Marzahn was the Industrial Host of the workshop.
Data conferences and guided line excursions befell at its new 2.600 m² manufacturing line, which opened in November 2019 for COB and SMT manufacturing. In accordance with Swissbit’s portfolio, this facility has a month-to-month capability of as much as 3 million models. Whereas having been an IDM and ODM working captive enterprise, Swissbit is making ready to open its packaging, meeting and check capabilities and capacities, providing OSAT providers to 3rd events.
Takeaways from the EuroPAT-Workshop
The highlights of the total-day workshop had been:
Abstract of the European funded Chips-JU CSA Pack4EU mission outcomes: “Packaging in Europe – Growing or Vanishing?” – with suggestions to the coverage makersOverview on regional actions, possibilities for packaging in EuropeUpdates from European OSATs, SPAT-SPs, and provide chain companions’ alternatives and plans in context with EU Chips ActPanel dialogue about funding alternatives and the required enchancment of the interface between RTOs and business, which as of at present is characterised by a expertise switch hole.
Key Takeaways from ESTC 2024
The ESTC is the biennial European flagship convention of and arranged by IEEE EPS (Electronics Packaging Society). This 12 months marked the tenth convention, which was a convincing success, marking a big milestone within the subject of superior packaging and system integration. The three-day occasion attracted 430 delegates (58% industrial and 42% tutorial) from 27 nations, bringing collectively professionals with numerous experience in expertise growth and industrial administration. Attendees contributed to the occasion with 4 keynote speeches, 117 oral shows, and 46 posters, sharing their in depth data and insights throughout classes and networking alternatives. The convention highlights had been:
3 Skilled Improvement Courses4 Keynotes, Heterogeneous Integration Roadmap (HIR) WorkshopPanel Dialogue on “Chiplets for Automotive”, 5 Particular Periods (EU Chips Act, IPCEI ME/CT, Training, Photonic Packaging, and Quantum Applied sciences)Greater than 50 exhibitors and Desk Prime shows, College Nook with 5 European universities or teams of universities lively in electronics packaging
Memorable highlights of the EuroPAT-Workshop and ESTC had been the social night occasions on Monday evening and Thursday evening. Each supplied nice locations for casual talks and networking. Attendees of the EuroPAT Workshop loved a dinner cruise on the river Spree with barbeque from the restaurant “Capt’n Schillow”. The ESTC dinner befell on the iconic “Wasserwerk”, the place attendees loved nice eating amidst the breathtaking views of the illuminated historic water pump station.Keep tuned for 4th SEMI EuroPAT-Workshop in 2025 – Grenoble, France, and the eleventh IEEE ESTC in 2026 – Helsinki, Finland.
Cowl Picture: Steffen Kröhnert, President & Founding father of ESPAT-Consulting and 3D InCites Consultant in Europe talked within the Particular Session on EU Chips Act and IPCEI ME/CT about the way forward for Packaging in Europe
