Brewer Science to Present Materials for Hybrid Bonding at IMAPS

Expertise increased integration density and improved efficiency via hybrid bonding strategies

Brewer Science, Inc., a pioneer in non permanent bonding and supplies for the semiconductor business, is presenting Materials for Hybrid Bonding at IMAPS Symposium 2024 on October 1st, 2024 at 1:15 pm (EST).

Challenges for Excessive-Temperature Processing in Semiconductor Packaging

Conventional high-temperature processing poses a problem when accommodating increased integration densities and improved efficiency in superior semiconductor packaging. Using low-temperature hybrid bonding with nanocrystalline copper (nc-Cu) and polymer supplies provides an answer to this problem by enabling environment friendly wafer-to-wafer and die-to-wafer bonding processes at considerably diminished temperatures.

“The development of high-performance materials is critical to advancing hybrid bonding technology,” says Dongshun Bai, Director of Enterprise Improvement, Senior Technologist at Brewer Science. “As we continue to innovate materials for high-performance computing and AI, we’re excited to share our progress at the IMAPS Symposium 2024.”

Larger integration densities and improved efficiency achieved by hybrid bonding purposes

Bai presents Materials for Hybrid Bonding at IMAPS Symposium 2024 on October 1st, 2024 at 1:15 pm (EST).  The presentation addresses materials challenges at the moment confronted in wafer-to-wafer and die-to-wafer hybrid bonding, whereas answering the business’s most important questions, together with:

How does non permanent and everlasting materials choice influence the method, and finally the gadget efficiency?What influence do dielectric supplies have on bond energy and reliability?Why are superior packaging supplies taking part in vital roles for profitable hybrid bonding processes?

The presentation covers key ideas from Chapter 4 of Direct Copper Interconnection for Superior Semiconductor Expertise. Members from Brewer Science’s group contributed to the data and information revealed in Chapter 4.

For these unable to attend the occasion, further info might be requested on our web site.