August has been an exciting month for the semiconductor {industry}, marked by notable achievements from our community members. From revolutionary new technological developments and workforce improvement initiatives, to thrilling {industry} occasions and partnerships, right here’s a bit about what our members have achieved.
Expertise Innovation:
Lam Analysis has launched Lam Cryo™ 3.0, the newest development in its cryogenic dielectric etch expertise, designed to satisfy the rising calls for of the AI-driven reminiscence market. This third-generation expertise is essential for manufacturing the following iteration of 3D NAND flash reminiscence, which requires ultra-precise etching of deep, slim excessive side ratio (HAR) reminiscence channels. Lam Cryo 3.0 leverages ultra-cold temperatures, superior plasma reactor expertise, and revolutionary floor chemistry to realize atomic-scale precision with a profile deviation of lower than 0.1%, considerably enhancing yields and efficiency for AI functions.
ACM Analysis has unveiled the Extremely ECP ap-p software, the primary of its variety to make use of horizontal plating for fan-out panel-level packaging (FOPLP). This revolutionary software delivers distinctive uniformity and precision throughout giant panels, making it perfect for superior packaging functions equivalent to GPUs and high-density reminiscence. Supporting panel sizes as much as 600mm x 600mm, it handles numerous plating processes, together with copper, nickel, and tin-silver. The software options superior automation and optimized electrical subject administration, enhancing manufacturing effectivity and lowering contamination dangers within the manufacturing of enormous, high-density panels.
Kulicke & Soffa launched its APTURA™ thermo-compression platform, advancing chiplet-enabling expertise for AI, HPC, cellular, and edge units. The platform has been adopted by key prospects and helps superior chiplet and stacked-die processes. Ok&S additionally demonstrated a brand new bumpless-FTC course of for chip-to-wafer hybrid bonding, increasing its market potential. Moreover, Ok&S joined the “US-Joint” consortium to additional packaging options, with a brand new R&D facility in Silicon Valley set to open in 2025. The corporate anticipates continued progress in superior packaging applied sciences.
StratEdge Company is revolutionizing semiconductor packaging with its superior molded and post-fired ceramic packages, designed for high-reliability in telecom, wi-fi, satellite tv for pc, and protection sectors. Their molded packages deal with excessive frequencies as much as 18 GHz, whereas post-fired ceramics handle thermal efficiency for compound semiconductors like GaN and SiC, as much as 63+ GHz. The corporate’s ISO 9001:2015 licensed facility includes a Class 1000 cleanroom and state-of-the-art meeting tools, together with a eutectic gold-tin attachment bonder. VP of International Gross sales, Casey Krawiec, emphasised the precision and thermal administration capabilities essential for optimum efficiency and reliability.
Veeco Devices Inc. introduced that IBM has chosen its WaferStorm® Moist Processing System for superior packaging functions and entered a joint improvement settlement to discover numerous moist processing applied sciences. The system, to be put in on the Albany NanoTech Complicated, helps essential hybrid bonding cleansing processes with excessive precision and suppleness, dealing with a number of wafer sizes and thicknesses. Veeco’s Vice President, Mathew Abraham, highlighted the system’s excessive throughput and cost-effectiveness, emphasizing its function in advancing packaging and applied sciences equivalent to cloud and AI. The WaferStorm system is acknowledged for its versatility in numerous markets, together with superior packaging, MEMS, and photonics.
HEIDENHAIN’s MULTI-DOF expertise is pivotal for advancing semiconductor manufacturing for AI techniques, shifting from monolithic chips to a chiplet method. This transition has pushed miniaturization from electrical-contact distances of 10 µm and accuracies of 1 µm to present requirements of two µm and 200 nm. HEIDENHAIN’s Dplus encoders, which seize as much as six levels of freedom, help this evolution by enhancing accuracy and productiveness in semiconductor manufacturing.
Partnerships:
SEMI’s Q2 2024 Semiconductor Manufacturing Monitor (SMM) Report, in partnership with TechInsights, reveals vital {industry} enhancements, together with sturdy IC gross sales progress, stabilized capital expenditure, and elevated wafer fab capability. Regardless of slower restoration in some finish markets, the demand surge for AI chips and excessive bandwidth reminiscence (HBM) is driving growth. IC gross sales grew 27% YoY in Q2 and are anticipated to rise 29% in Q3, surpassing 2021 ranges. Wafer fab capability reached 40.5 million wafers per quarter, with forecasts for a 1.6% enhance in Q3. Capital expenditures, down 9.8% YoY within the first half, are anticipated to show optimistic, pushed by reminiscence investments. SEMI and TechInsights spotlight a restoration within the semiconductor provide chain, with AI and HBM driving progress and getting ready the marketplace for a surge in 2025.
3D PLUS is proud to help the European House Company’s Jupiter Icy Moons Explorer (JUICE) mission with its high-reliability SDRAM, NAND FLASH, EEPROM, and SRAM elements, making certain strong information storage for mission-critical operations. JUICE not too long ago achieved a milestone by finishing a flyby utilizing the gravity of each Earth and the Moon and can proceed on to Jupiter and its icy moons.
Workforce Improvement:
The SEMI Basis and Coverage Fairness Group have partnered to handle the childcare wants of the U.S. semiconductor workforce, significantly in gentle of the U.S. CHIPS and Science Act. Funded by the W.Ok. Kellogg Basis and the David and Lucile Packard Basis, this collaboration goals to strengthen native childcare techniques in Arizona, Ohio, and Michigan. The initiative will contain panorama analyses of the semiconductor workforce and native childcare techniques, focused outreach to attach girls and underrepresented minorities to the {industry}, and the event of childcare plans that meet CHIPS Act necessities. The SEMI Basis, together with its companions, seeks to create community-based options and supply assets to employers, in the end supporting the expansion and sustainability of high-quality, inexpensive childcare in semiconductor communities.
Cadence Design Programs has launched Fem.AI, a $20 million initiative to advertise gender fairness within the tech sector, specializing in AI alternatives. Over the following decade, the Cadence Giving Basis will present funding and help to nonprofits, college packages, and women-led ventures aligned with Fem.AI’s mission. The initiative addresses key challenges equivalent to low feminine commencement charges in laptop science, difficulties in securing AI jobs, and excessive attrition charges amongst girls in tech. The inaugural Fem.AI Summit shall be held on October 1 to foster industry-wide collaboration on gender fairness.
Awards:
Indium Company has honored 9 workers with its Silver Quill Award for his or her contributions to technical content material creation within the electronics {industry}. The award acknowledges revolutionary and cutting-edge analysis shared by way of convention papers, articles, and displays. This 12 months, two papers have been highlighted: one on a bismuth-free, indium-containing solder paste for wafer-level packaging and one other on lowering vitality consumption utilizing low-temperature solder alloys. Indium Company President and COO, Ross Berntson, inspired the honorees to proceed sharing their experience, emphasizing that their work not solely excites prospects, nevertheless it additionally strengthens the corporate’s place as an {industry} chief and fosters a tradition of steady studying and enchancment.
LQDX has been acknowledged in Semiconductor Evaluate Journal’s High 10 Semiconductor Manufacturing Awards for this 12 months, alongside distinguished companies equivalent to Utilized Supplies, Microchip Expertise Inc., and Plasmatreat.
Sustainability:
SEMI launched its first region-specific evaluation of South Korea’s low-carbon vitality (LCE) markets to assist the semiconductor {industry} scale back greenhouse gasoline emissions. The report, developed by the SEMI Power Collaborative (EC) with enter from companions and the South Korean authorities, highlights the necessity for elevated LCE investments and coverage adjustments. It initiatives a big hole in South Korea’s skill to satisfy 2030 company LCE targets, doubtlessly reaching as much as 50 TWh. Key suggestions embody enhancing LCE procurement, enhancing community collaboration, and streamlining rules for photo voltaic and wind initiatives. SEMI is working with South Korea’s Ministry of Commerce, Trade, and Power (MOTIE) to implement these options.
Occasions:
The IEEE Digital Parts and Expertise Convention (ECTC) will mark its seventy fifth anniversary from Might 27-30, 2025, on the Gaylord Texan Resort & Conference Middle in Dallas. The convention will function over 2,000 attendees discussing developments in semiconductor packaging, together with rising applied sciences. Summary submissions are due by October 7, 2024, with particulars obtainable at www.ectc.internet.
Indium Company will showcase its superior heterogeneous integration and meeting (HIA) merchandise and thermal interface supplies (TIMs) at SEMICON Taiwan, September 4-6, in Taipei. Key choices embody the SiPaste® collection for fine-feature printing, with new SiPaste® C312HF offering wonderful efficiency and simple cleanability. Their Warmth-Spring® TIMs, perfect for TIM2 functions, ship excessive thermal conductivity and sustainability, whereas the GalliTHERM® portfolio options gallium-based liquid metals for superior warmth dissipation and longevity. Go to sales space #L0330 at SEMICON Taiwan to see how Indium’s improvements are driving AI developments.
EV Group (EVG) will showcase its newest 3D integration course of options, together with hybrid and fusion wafer bonding, IR laser layer launch expertise, and superior lithography at SEMICON Taiwan 2024. Highlights embody displays on EVG’s LITHOSCALE® maskless publicity system and disruptive 3D integration applied sciences for stacked techniques. Dr. Thorsten Matthias notes Taiwan’s essential function in semiconductor manufacturing, and EVG’s growth in native workplaces underscores its dedication to the area. Go to EVG at sales space L0316 for insights into their developments in automotive, communications, HPC, AI, and AR/VR.
Yield Engineering Programs introduced its debut at SEMICON India from September 11-13, 2024. Attendees are invited to go to sales space H1S11 to find how YES’s merchandise are engineering the clever future. Moreover, YES will host a fireplace chat discussing India’s pivotal function within the superior packaging ecosystem.
ASE Malaysia hosted C-suite executives from main government-linked funding companies and officers from key Malaysian authorities businesses. This effort was led by Deputy Minister, YB Chin Tong Liew, as a part of a semiconductor research tour organized by Khazanah Nasional Berhad and REFSA. The go to highlighted ASE International’s management in IC packaging, current developments in Penang, and future plans, together with an AI-driven wire bond line. The occasion facilitated worthwhile dialogue on advancing Malaysia’s function within the world semiconductor provide chain, with a give attention to creating job alternatives and strengthening collaboration.
KLA workers from world wide not too long ago participated in an prolonged actuality hackathon hosted on the firm’s India workplace. The occasion highlighted innovation and teamwork throughout areas.
Firm Developments and Alternatives:
Finetech has launched a brand new enterprise improvement crew, combining skilled professionals and recent expertise to raise course of improvement and shopper help. This crew is devoted to creating versatile, machinery-independent processes to boost shopper help and place Finetech as a high answer supplier. Their mission is to construct and refine processes that maximize income potential and increase manufacturing system effectivity, specializing in innovation and precision to ship high-quality options.
ACM Analysis introduces Sally Ann Henry as their new chief technologist.
SEMI is hiring a communications coordinator for EU-Funded initiatives in Berlin.
Mosaic Microsystems is hiring a senior R&D challenge supervisor based mostly out of Rochester, New York.
Onto Innovation is hiring a challenge supervisor based mostly out of Wilmington, Massachusetts.
Yield Engineering Programs is hiring a technical help engineer based mostly out of Chandler, Arizona.
