Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging

Advanced wafer-level packaging breakthroughs the following wave of technology in international chip production

TEMPE, Ariz.– March 19, 2024– Arizona State University (ASU) and Deca Technologies (Deca), a premier company of advanced wafer- and panel-level packaging modern technology, today revealed a cutting-edge cooperation to develop North America’s first fan-out wafer-level packaging (FOWLP) research study and advancement ability.

The brand-new Center for Advanced Wafer-Level Packaging Applications and Advancement is established to militarize technology in the USA, increasing residential semiconductor production capacities and driving innovations in sophisticated areas such as expert system, artificial intelligence, automobile electronic devices, and high-performance computer.

The center will certainly incorporate modern advanced-packaging modern technology, tools, procedures, products, competence, and training, promoting the advancement of brand-new capacities from evidence of idea to pilot range. ASU is the first university application of Deca’s M-Series ™ fan-out and Flexible Pattern ® technologies under the Microelectronics Commons, a network of local modern technology centers collaborated to supply on tasks asked for by the Division of Protection as component of the CHIPS and Scientific Research Act, the government regulations which intends to increase America’s international management in microelectronics.

The brand-new center will certainly consist of combination with the university’s MacroTechnology Functions center at ASU Study Park in Tempe and will certainly supply boosted ability to development tasks within the ASU-led Southwest Advanced Prototyping (SWAP) Center, component of the Microelectronics Commons.

“This is at the heart of the next generation of innovation in microelectronics and everything it enables,” claimed Zak Holman, vice dean for research study and technology for ASU’s Individual retirement account A. Fulton Schools of Design. “Deca has developed a unique technology, and ASU brings extraordinary capacity that will provide the resources to leverage Deca’s technology in ways that will be a differentiator for the work we are doing together through the SWAP Hub.”

The effort additionally uses a workforce-development chance with ASU professors and pupils participating in the job being done, supplying training for the expanding variety of specialists that are required locally, consisting of in city Phoenix metro, which is home to Intel, TSMC, Amkor Modern Technology. and various other firms.

In cooperation with Deca, ASU is devoted to developing onshore accessibility to these advanced packaging capacities. This requires getting, setting up, and applying a detailed collection of procedure and assessment tools at the center, efficient in fitting both 200mm and 300mm gadget wafer styles, along with 300mm M-Series built fan-out wafers, supplying unmatched adaptability for a varied variety of clients and applications.

“With the industry’s leading fan-out technology1 as a foundation, we’re excited about the possibilities this new center brings to Arizona as well as the broader U.S. semiconductor industry,” commented Tim Olson, Deca’s owner and CHIEF EXECUTIVE OFFICER. “Through ASU and Deca’s collaboration, unprecedented access for industry, academia, government, and others opens the door to accelerate innovation and bolster U.S. technology leadership.”

Deca’s first-generation M-Series FOWLP is extensively taken on in leading mobile phones around the world. The Gen 2 M-Series consisting of Flexible Pattern modern technology brings unmatched scaling to greater thickness for heterogeneous combination and chiplet applications.

1M-Series is the highest-volume fan-out modern technology, with over 5 billion gadgets in the area.