Arizona is on a path to becoming a leading hub for advanced packaging innovation with collaborative efforts from ASU, local governments, and private sector companies. The state is focusing on strengthening its semiconductor manufacturing sector to reduce its dependence on overseas markets and meet growing demands for advanced technologies.
In 2022, the CHIPS Act was passed, highlighting a $53 billion investment in onshoring semiconductor manufacturing, with $1.6 billion allocated for advanced packaging. This investment is reshaping the industry’s perspective on packaging, moving it from a cost burden to a critical element for advancing technology.
Advanced packaging technologies like 2.5D and 3D stacking are essential for meeting the requirements of emerging technologies like AI and HPC. Arizona is emerging as a key player in this industry, with private sector companies like Amkor and YES establishing facilities in the state to drive innovation and create job opportunities.
ASU plays a vital role in enhancing Arizona’s semiconductor ecosystem by providing a skilled and talented workforce. The university collaborates with companies like Deca Technologies to advance packaging research and development, with a focus on technologies like Fan-Out Wafer-Level Packaging (FOWLP).
Established semiconductor companies in Arizona, like EV Group and Finetech, are benefiting from the state’s growing focus on advanced packaging. They are engaging in customer partnerships, internship programs, and research collaborations to leverage the funding and opportunities arising from initiatives like the CHIPS Act.
Overall, Arizona’s efforts in advanced packaging are paving the way for a thriving ecosystem that fosters innovation, collaboration, and talent development. With a strong commitment from all stakeholders, the state is on track to become a prominent player in the North American packaging industry.
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