IFTLE 587: Intel Glass Core Substrate Update

In late Feb INEMI held a Product packaging Technology Subject Webinar: Glass Substratums for Advanced Product packaging which existed by Dr. Dilan Seneviratne and Dr. Gang Duan of Intel Company. Dilan Seneviratne is a Principal Designer and Supervisor of Dielectrics and Surface Area Preparation Location within Intel’s Substrate Product packaging Modern technology Advancement company. Gang Duan is a Principal Designer and Location Supervisor/ Design Supervisor for the Backend location in the Substrate Product packaging TD company within Setting up Examination TD atIntel He has actually been included with establishing EMIB/ EMIB-TSV pass away embedding, along with HDI substrate backend procedure, tools, and products modern technologies.

Intel openly revealed its initiatives on glass core substratums in Sept of 2023 and we have actually reviewed this in IFTLE 575.

If we consider the most recent Intel Advanced Product packaging roadmap, we can see that it has actually included glass core substratums to its roadmap offerings.

Intel explained that there have actually been significant substrate innovation transforms concerning every 15 years because the beginning of leadframe/ cable bond bundles in the 1970s as received Number 2.

As IFTLE gone over formerly (IFTLE 575), Intel’s strategy is to change the typical woven glass core discovered in typical laminates with a strong glass core. The benefits can be seen in Number 3, such as greater dimensional security, greater through-hole thickness, and greater rate signaling.

This will certainly call for the existence of a “glass package ecosystem” that will certainly consist of modern technologies formerly created in the PCB, back-end wafer fab, and level panel display screen markets (Number 4).

Intel suggests that it has actually been working with this innovation for over a years and are spending over $1B in a glass R&D line in its Chandler AZ center. The business states it is functioning carefully with tools and products companions to allow the environment. It has actually created a digitally useful set up multi-chip bundle (MCP) examination lorry with 3 redistribution layers (RDL) and with glass vias (TGVs) of 75µm. Filled up TGVs have a 20:1 facet proportion for 1mm core density, supposedly matched for AI and information facility applications. Intel asserts to have greater than 600 developments pertaining to style, procedures, tools, and products. (Number 5).

Numerous fascinating concerns showed up throughout the Q&A session:

One commenter explained that TSMC reported at the 2011 IEEE ECTC that “The brittle nature of glass along with its low fracture strength, particularly with TGV, could have serious implications on the reliability of the packaging system using a glass substrate.” Intel suggested understanding of this and is working with the problem.
One more concern asked regarding the dielectric that was being utilized for the RDL layers. The Intel action was that it is analyzing a variety of opportunities [not just Ajinomoto build-up film (ABF) ] however has actually passed by one product yet.
Intel suggested that this “double-sided process” was “difficult” with glass handling being a concern.
When inquired about integrity information, Intel suggested that tensions are a concern and they are functioning to decrease them. A business agent mentioned that they had no integrity information to share now.

Altogether, IFTLE ends that anybody preparing for see such frameworks in Intel business manufacturing prior to 2030 need to not hold their breath!

However keep in mind, Intel is not the only business checking out such modern technologies.

Absolics Glass Core Substratums

IFTLE was the very first to show you that SKC (a subsidiary of South Oriental Chaebol SK Team) has actually revealed that it is raising a $600MM glass substrate manufacturing plant in Covington Georgia with strategies to broaden it to 72,000 sq-meter by 2025 (KEEP IN MIND IFTLE believes 2025 for a certified production day is additionally possibly a little bit hostile) (Number 6)

My major message right here is that glass core substratums show up to have actually made the roadmaps of a number of significant vendors, substantial cash are being invested and they are something ought to be expecting in the future …

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