In 2024, Trymax Semiconductor Equipment B.V. experienced significant growth with various milestones achieved. The year saw the successful launch of a new manufacturing facility, the establishment of a dedicated Quality Department, the addition of more Field Service Engineers to the team, and the strengthening of the USA team resulting in multiple purchase orders.
In the market, the automotive sector remained stable, especially in silicon carbide (SiC) applications, while other sectors experienced slower growth. However, there was a noticeable increase in data storage and accessibility, driven by the rising demand for high-speed data access everywhere.
Trymax’s most substantial growth came from advanced packaging applications in 2D, 2.5D, and 3D packaging technologies. These technologies allow for different levels of integration and performance improvements, with through-silicon vias fabricated using the Bosch process.
Trymax’s Process Module is highly efficient in cleaning residual polymer after the Bosch process and creating bowl etches for easier copper filling of vias. Before Chip-to-Wafer (C2W) or Wafer-to-Wafer (W2W) stacking, surface cleaning and activation are essential, which Trymax’s low-cost Process Module simplifies.
Overall, Trymax extends gratitude to customers and suppliers for their trust and confidence in the company throughout the year. For more insights, check out the full article in the 2025 3D InCites Yearbook.
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